2D/3D equipment drawing capabilitiesHigh-level uniformity in circuit platingFlexible and open gantry program, maximizing production capacity utilizationHigh uniformity cathode and anode design, surface copper thickness ±10%Highly precise chemical control system for solutionsUltra-high aspect ratio for both chemical and electroplating equipment
2D/3D equipment drawing capabilities
High-level uniformity in circuit plating
Flexible and open gantry program, maximizing production capacity utilization
High uniformity cathode and anode design, surface copper thickness ±10%
Highly precise chemical control system for solutions
Ultra-high aspect ratio for both chemical and electroplating equipment
Selection of fire-resistant and environmentally friendly materials
Experience and design focused on energy efficiency and carbon reduction
Automatic tank cleaning system
Compatible with intelligent AI products for achieving smart production
Process capability
300 X 300mm~650 X 650mm
Adjustable based on customer requirements Board dimensions
